Nordson YESTECH (www.nordsonyestech.com), a leading provider of X-ray inspection and automated optical systems for the electronics industry, is proud to introduce the company’s latest X1 semi-automatic, batch loading X-ray inspection system. The latest X1 X-ray offers EMS semiconductor packagers and providers a superior yield enhancement solution in reducing costs, to increase throughput and improve quality.
The new X1 X-ray from Nordson YESTECH provides machine users with high-resolution X-ray capability in a compact, maintenance free and flexible free configuration. The X1 X-ray is best suited for inspecting mixed plated though hole (“PTH”) assemblies, connectors and BGA/SMT devices. The high power 130 kV X-ray source gives large amount of energy to image even for the most demanding samples such as those with metal sinks.
The new X1 is available with a four or five axis sample manipulator and a 15 in. x 20 in. (“380 mm x 508 mm”) X to Y travel for samples up to five pounds in weight. Thirty degrees of tilt and full 360 degrees of rotation are available. The stepper motor drives give a broad range of motion from super slow use in high magnifications, to make travel over large distances much faster. All systems are designed with a one-of-a-kind programmable motion and control module for automated inspection.
The new X1 comes with the company’s proprietary machine vision technology for a fully automated inspection of flip chip and BGA devices. Automated inspections include correct assembly, die attach and bond wire verification.
“X-ray Inspection is an important tool for EMS providers in achieving high quality standards”, said Nordson YESTECH President Don Miller. “Used for process / quality control and failure analysis, the X1 provides powerful inspection capability, accurate inspection results and a quick return on investment”