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You are here: Home / Networking + IoT / Sensors + Vision / Linear Inductive Position Sensors for Clamping Technology from Balluff

Linear Inductive Position Sensors for Clamping Technology from Balluff

September 23, 2011 By Miles Budimir Leave a Comment

Florence, Ky. – Balluff’s new BIP linear inductive position sensor has an absolute measuring principle for position monitoring in applications such as drive spindles and clamping devices for tools and workpieces. The sensor can also be used for many other linear motion applications such as punch depth, grab positions, rolling positions, and valve positions, among others. 

The BIP is non-contact and linear travel of up to 40mm can be reliably detected.  The Balluff BIP has a resolution of 14 microns, high repeat accuracy of +/- 80 microns and non linearity of +/- 250 microns for optimal process quality. Available outputs include 0…10V and 4…20mA.  The sensor’s high degree of repeat accuracy guarantees excellent process quality, even in cramped locations with temperatures up to 85°C.

Mechanical adjustments are not necessary as the sensor is teachable on site, allowing the measuring range to be adapted to the application. With the IO-Link Variant this is also possible via the control system.

For more information on Balluff’s BIP linear inductive positioning sensors, visit www.balluff.com/BIP.

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