North American packaging machinery users and OEMs benefit from familiar ladder-logic programming, but new packaging-automation software is easier. As machine functionalities become more sophisticated, ladder programs can become too complicated, even when supplemented by function blocks. Modular application (mapp) technology from B&R maintains familiar, IEC compliant ladder and function block programming – except with mapp components, more time is spent on configuring rather than programming.

mapp technology also provides a fast, easy way to implement OMAC PackML, the ISA TR88.00.02 standard for defining machine states, modes and tag naming conventions. With mapp Technology, machine control can be accessed and diagnosed down to the function block level without requiring dedicated software, special training or access to the source code. More after the jump.

2015 Pack Expo attendees can see first-hand how mapp technology can cut programming time by two-thirds, while simplifying recipe changes, diagnostics, integration, and field modifications at the B&R booth. A B&R representative will also be present at the OMAC (Organization for Machine Automation and Control) booth 1241 in the Central hall from 9:00-10:00 a.m. on Wednesday, September 30 ready to discuss the capabilities of mapp PackML.

High performance and scalability in a compact design

OEMs are looking to automation suppliers for solutions to help them achieve scalability in their operations. The new ACOPOS P3 from B&R is a three-axis servo drive that affords significant space savings in the control cabinet and includes integrated safety functions. It is suitable for both single and multi-use applications and can be scaled to meet a variety of performance and functional requirements at an attractive cost. And despite its compact design, it features a sampling time of 50 µsec for the entire controller cascade, making it the fastest servo drive with safety functions on the market.

 Other booth highlights will include the Automation PC 2100 – a fully equipped industrial PC with an ultra-compact form factor, IP69K rated stainless steel motors, secure remote diagnostics, as well as B&R’s C-Series Power Panels, which are terminals with a built-in PLC, that use an Intel Atom processor to achieve cycle times down to 1 msec.

Fifth Annual PACK Solutions Challenge

B&R Industrial Automation’s Packaging Solutions Group is also sponsoring the PACK Solutions Challenge, where teams from PMMI Partner Schools research and develop a real-world packaging solution. This year, students had to create a proposal for a dedicated line to package and ship a new fast-dissolve OTC product for the fictional company Innovative Pharmaceuticals Inc.

Show attendees can view the students’ proposals and vote for their favorite at the Education & Workforce Development Pavilion at PACK EXPO. The winning team will be announced at 3:30 p.m. on Tuesday, September 29 in the B&R booth.